Jing Shang
Email: jing.shang@wsu.edu
Phone: 509-339-9225
Office: ETRL 349
I’m a Ph.D. student in the Materials Science and Engineering Program at WSU, advised by Dr. John McCloy. My research focuses on CdTe preparation, characterization, and application; photovoltaic materials; and interface reaction.
Education:
· 2014-2017 Master, Shanghai Jiao Tong University, China, Materials Science & Engineering
· 2007-2011 Bachelor, Sichuan University, China, Materials Science & Engineering
Research Interests:
· Photovoltaic materials for solar cells
· The reaction between interface and surface
Links：
Selected Publications:
1.J. Shang, M. Murugesan, S. Bigbee-Hansen, S.K. Swain, J.N. Duenow, S. Johnston, S.P. Beckman, H.H. Walker, R.W. Antonio, and J.S. McCloy, “The effect of dopant concentration and annealing treatments on N-type Iodine doped CdTe,” Journal of Alloys and Compounds, 960, 170625 (2023). https://doi.org/10.1016/j.jallcom.2023.170625
2.Jing Shang, Magesh Murugesan, Rubi Gul, Samuel Bigbee-Hansen, Joseph M. Tallan, Joel N. Duenow, John S. McCloy, “Structural and Electronic Properties of Indium-Doped n-type Cd-Se-Te Crystals” Journal of Electronic Materials 53(7), 3848-3860 (2024). https://link.springer.com/article/10.1007/s11664-024-11094-w
3.Jing Shang, Joel N. Duenow, Steve W. Johnston, Helio R. Moutinho, Magesh Murugesan, John S. McCloy, “Characterization of n-Type Iodine-Doped and Indium-Doped CdTe/Cd-Se-Te Thin Films Fabricated by Close-Spaced Sublimation Epitaxy” 2024 IEEE 52nd Photovoltaic Specialist Conference (PVSC), Seattle, WA, USA, 2024, pp. 1523-1531, https://ieeexplore.ieee.org/document/10749310
4.Jing Shang, Jordan Barr, Scott Beckman, John S. McCloy, “Defect Levels and Self-compensation in Iodine-Doped CdTe Single Crystals” Journal of Applied Physics 138.4 (2025). https://doi.org/10.1063/5.0254610
5.Shang J, Hao J, Hang T, et al. Diffusion barrier effect of Ta/Ti bilayer in organic dielectric/Cu interconnects[J]. Thin Solid Films, 2018, 653.
6. Shang J, Hao J, Deng Q, et al. Interface adhesion study of Cu interconnection and low-k organic materials[C]// International Conference on Electronic Packaging Technology. IEEE, 2016:686-689.