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Washington State University Institute of Materials Research

Cleanroom Process Capabilities

Thin Film

Atomic Layer Deposition

Our Ultratech ALD machine can deposit a wide variety of films at the atomic level. Films are very conformal even in high-aspect ratio features. The chamber supports up to 8″ diameter substrates and a taller lid can accommodate samples as large as 3″ tall. Please contact us for a list of materials available.

Sputter Coating

Our BOC Edwards Auto 306 Sputter System is capable of sputtering a wide range of materials using both RF and DC power. The chamber can be cryocooled with liquid nitrogen and has a typical pump down pressure of 2.0 10-7 Torr. We have four sample supports: 3″ wafer (6), 4″ wafer (6), 12″ diameter plate, 5″ x 8″ paddle.

Target Materials: 

  • Aluminum
  • Aluminum Oxide
  • Chromium
  • Carbon
  • Copper
  • Erbium
  • Gold
  • Holium
  • Indium
  • Iron
  • Indium Tin Oxide
  • Lead Magnesium Niobate
  • Molybdenum
  • Nickel
  • Platinum
  • Pyrex
  • Robak
  • Silicon Dioxide
  • Silver
  • Tin
  • Titanium
  • Titanium Nitride
  • Titanium Tungsten
  • Tungsten

Spin Coating

This WS-650M laurell spin coater  is used to uniformly distribute photoresist by spinning the substrate. Some common materials we use with the spin coater include: positive photoresists (AZ 5214, AZ P4620), SU-8 series negative epoxy-based resists, PZT sol-gel solutions, iron oxide sol-gel solutions, and ProTEK protective coatings.

The maximum speed of the machine is 12,000 rpm and can accomodate sizes between 1/8″ and 6″ (or 5×5″ masks). We have a three different vacuum chucks to handle almost any size sample and have a centering tool to ensure uniform layers.


Mask Aligner

This OAI Hybralign Series 500 has a wafer chuck, microscope and UV lamp modules. It can align features to 10’s of microns precision.

Thermal Processes & Equipment

Rapid Thermal Annealing

The Heatpulse 610 Rapid Thermal Processing System uses high-intensity radiation to heat single wafers for short periods of time. It has a small chiller coupled to it that allows for extremely precise heating and cooling cycles. The RTA has a wide range of applications from PZT curing with a lead-enriched susceptor to platinum annealing.

Oxidation Growth

The upper Experitech 6-Inch Diameter Tube Furnace for oxidation growth and typically grow a 200 nanometer SiO2 for an insulating film.

Boron Diffusion

The lower Experitech 6-Inch Diameter Tube Furnace for boron diffusion and typically we diffuse a 2 micron boron etch stop.

Vertical Furnace

Our vertical furnace is available for annealing multiple wafer batches.

Vacuum Oven

This Thelco Model 19 vacuum oven is used for curing epoxies and two-part polymers that off-gas during curing.

Thermal Hydraulic Press

This manual laboratory press is ideal as an FTIR press, KBr press and XRF press.



Dektak XT profilometer uses a mechanical stylus to trace a linear surface profile of the sample. System has a motorized stage with 150mm travel. Step height repeatability is 4Å, 1 sigma on steps <1um(30scans using the 12.5um stylus) .

  • Step height measurement up to 1mm
  • Surface roughness
  • Automated 3D mapping


This Gaertner Production Ellipsometer has a laser that emits light at an angle through any transparent film and a detector at the opposing angle. Using the refractive index of the film and Snell’s Law, it is able to calculate the thickness of the film.

Water Etching


We use a number of acid and acid solutions to etch silicon, teflon and oxides.


Our BOE wet bench has a BOE bath, a two-compartment overflow bath, and two dump-rinsers. This bench is presently dedicated to BOE etching only.


We have many solvents available in the cleanroom for processes such as platinum lift-off or wafer cleaning.

Dry Etching


This South Bay Technologies PE 2000 is currently configured for manual control of O2 and CF4 gasses and can be used to etch isotropically, clean wafers and bond polymers.

Reactive Ion

This South Bay Technologies RIE-2000 has a turbomolecular pump, four mass flow control channels and can anisotropically etch a variety of materials including but not limited to: silicon, silicon nitride, aluminum, silicon carbide and photoresist.

Deep Reactive Ion

This Oxford Plasmalab 100 has an inductively coupled plasma source and an automatic load lock and is able to rapidly etch anisotropically. We have CF4, SF6, He, Ar and liquid N2 currently available for process gasses.