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Washington State University Center for Materials Research

Cleanroom Process Capabilities

Thin Film

Atomic Layer Deposition

Our Ultratech ALD machine can deposit a wide variety of films at the atomic level. Films are very conformal even in high-aspect ratio features. The chamber supports up to 8″ diameter substrates and a taller lid can accomodate samples as large as 3″ tall. Please contact us for a list of materials available.

Sputter Coating

Our BOC Edwards Auto 306 Sputter System is capable of sputtering a wide range of materials using both RF and DC power. The chamber can be cryocooled with liquid nitrogen and has a typical pump down pressure of 2.0 10-7 Torr. We have four sample supports: 3″ wafer (6), 4″ wafer (6), 12″ diameter plate, 5″ x 8″ paddle.

Target Materials: 

  • Aluminum
  • Aluminum Oxide
  • Chromium
  • Carbon
  • Copper
  • Erbium
  • Gold
  • Holium
  • Indium
  • Iron
  • Indium Tin Oxide
  • Lead Magnesium Niobate
  • Molybdenum
  • Nickel
  • Platinum
  • Pyrex
  • Robak
  • Silicon Dioxide
  • Silver
  • Tin
  • Titanium
  • Titanium Nitride
  • Titanium Tungsten
  • Tungsten

Spin Coating

This WS-650M laurell spin coater  is used to uniformly distribute photoresist by spinning the substrate. Some common materials we use with the spin coater include: positive photoresists (AZ 5214, AZ P4620), SU-8 series negative epoxy-based resists, PZT sol-gel solutions, iron oxide sol-gel solutions, and ProTEK protective coatings.

The maximum speed of the machine is 12,000 rpm and can accomodate sizes between 1/8″ and 6″ (or 5×5″ masks). We have a three different vacuum chucks to handle almost any size sample and have a centering tool to ensure uniform layers.


Photolithography

Mask Aligner

This OAI Hybralign Series 500 has a wafer chuck, microscope and UV lamp modules. It can align features to 10’s of microns precision.

Mask Fabrication

We routinely design and fabricate masks for a wide variety of photolitghography applications in both chrome and mylar.


Thermal Processes & Equipment

Rapid Thermal Annealing

The Heatpulse 610 Rapid Thermal Processing System uses high-intensity radiation to heat single wafers for short periods of time. It has a small chiller coupled to it that allows for extremely precise heating and cooling cycles. The RTA has a wide range of applications from PZT curing with a lead-enriched susceptor to platinum annealing.

Oxidation Growth

The upper Experitech 6-Inch Diameter Tube Furnace for oxidation growth and typically grow a 200 nanometer SiO2 for an insulating film.

Boron Diffusion

The lower Experitech 6-Inch Diameter Tube Furnace for boron diffusion and typically we diffuse a 2 micron boron etch stop.

Vertical Furnace

Our vertical furnace is available for annealing multiple wafer batches.

Vacuum Oven

This Thelco Model 19 vacuum oven is used for curing epoxies and two-part polymers that off-gas during curing.

Thermal Hydraulic Press

This manual laboratory press is ideal as an FTIR press, KBr press and XRF press.


Measurement

Profilometry

This SPN Technologies Inc. Profilometer uses a mechanical stylus to trace a linear surface profile of your samples.

To Save Your Profilometer Files:

  • Create a personal folder in the Phddata folder: phddata\yourname
  • Save file created by profilometer to: C:\phddata\yourname\filename

To Reconfigure Data:

  • Paste a copy of the phdcnv.exe file in your personal folder. You can find the phdcnv.exe file in the phddata folder.
  • Open the DOS window and change the directory to your folder location: cd\phddata\yourname.
  • Run the phdcnv.exe program with the execution: phdcnv.exe filename.pfl
  • When you re-open your personal folder, the new data file that you created will be there.

Ellipsometry

This Gaertner Production Ellipsometer has a laser that emits light at an angle through any transparent film and a detector at the opposing angle. Using the refractive index of the film and Snell’s Law, it is able to calculate the thickness of the film.


Wire Bonding

Ball

This Hybond 522A Ball Bonder can be used to adhere balls (“bumps”) or wires to a microfab sample. This can be useful when packaging samples to chip carriers.

Wedge

Kulicke and Soffa Model 4123 Wedge Bonder


Water Etching

Acid

We use a number of acid and acid solutions to etch silicon, teflon and oxides.

BOE

Our BOE wet bench has a BOE bath, a two-compartment overflow bath, and two dump-rinsers. This bench is presently dedicated to BOE etching only.

Solvent

We have many solvents available in the cleanroom for processes such as platinum lift-off or wafer cleaning.

Dry Etching

Plasma

This South Bay Technologies PE 2000 is currently configured for manual control of O2 and CF4 gasses and can be used to etch isotropically, clean wafers and bond polymers.

Reactive Ion

This South Bay Technologies RIE-2000 has a turbomolecular pump, four mass flow control channels and can anisotropically etch a variety of materials including but not limited to: silicon, silicon nitride, aluminum, silicon carbide and photoresist.

Deep Reactive Ion

This Oxford Plasmalab 100 has an inductively coupled plasma source and an automatic load lock and is able to rapidly etch anisotropically. We have CF4, SF6, He, Ar and liquid N2 currently available for process gasses.